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We are a young, flexible, international minded team of 60 individuals, highly motivated by the fine technology products we are selling. Our major suppliers are located in France, Japan, Korea, New Zealand, Taiwan and the United States. Our product portfolio sports digital and analog semiconductor ICs (memories and logic LSIs) as well as electronic components, such as touch screens, sockets, connectors, power supplies and complete modules for wireless communications.

Welcome



We are a young, flexible, internationally minded team of 60 individuals, highly motivated by the fine technology products we are selling. Our major suppliers are located in Japan, PR China, France, Korea, New Zealand, Taiwan and the United States. Our product portfolio sports digital and analog semiconductor LSIs (video, network, communications, memories, etc.), touch screens as well as electromechanical components, such as sockets, connectors, heat sinks, all the way up to power supplies and complete modules for imaging and wireless communications. We also customize and test Printed Circuit Board assemblies.

Featured Products

Introducing highlights of our suppliers

New High-Performance LDO's from Taejin Technology


TJ114 packages TAEJIN Technology's new series of 300mA LDO's, TJ114, are specifically tailored to mobile and portable applications. The series boasts a very high rejection ratio (PSRR) as well as voltage accuracy and very low dropout voltage.

All variations possess an Enable function for power saving while the "D"-version adds Auto-discharge function when disabled. The input voltage ranges from 1.4 to 5.5V, while fixed output voltages from 0.8 to 3.6V are available in intervals of 0.1V.

Abundant packaging options include 1.0x1.0mm and 1.2x1.6mm DFN4, as well as SC70-5 and SOT23-5 packages with small form factor.

The TJ114 series can be offered at lower cost than rivalling offers.

Sequans Introduces Sequans AIR™

Active Interference Rejection for LTE™ end user devices.
Sequans AIR Logo

White Paper



New technology implemented on Sequans latest LTE™ platforms can double network capacity:
  • Up to 3.5 x throughput increase at cell edge
  • Up to 2x network capacity increase
  • Improved user experience in dense deployments


Andromeda Platform LTE™ Semiconductor Solution

SQN3110 LTE™ Baseband System-on-Chip for Mobile Devices

SQN3110
Based on seven years of innovation in 4G technology, SQN3110 is a slim and powerful LTE™ baseband chip, part of Sequans' Andromeda platform. Designed for the highest possible efficiency either as a standalone LTE 4G solution or alongside a 3G subsystem, SQN3110 is the industry's most compact and cost-effective solution for adding 4G LTE connectivity to 4G mobile devices.

Product Line-up...



NextWindow Touch Screens for the Strictest Requirements
Featuring its Optical Touch Technology, NextWindow develops touch-screen assemblies from high-volume delivery all the way up to customized solutions. NextWindow's manufacturing and service capabilities meet the requirements of many projects.

Details
SQN3220 Sequans Introduces LTE-Advanced Chip
Designed for the highest possible efficiency, either as a standalone 4G solution or alongside a 3G subsystem, SQN3220 is a highly compact and cost-effective solution for adding LTE connectivity to 4G devices.
Details
THCV226 THine Electronics, Inc.
Designed to support video data transmission up to 1080p/10b/120Hz between the host and a display, THCV226 can receive 32-bit video data and 3-bit control data via four differential pairs of V-by-One® HS lanes. The maximum serial data rate is 3.4Gbps/lane.
Details
Sanico Electronics
The AOS3729A-T42 is a front-type MEMS microphone with analog signal output featuring low impedance, thus very high immunity to RF noise. Thanks to excellent thermal characteristics, the product is best prepared for fully automated assembly.
Details
Taejing Technology
New from Taejing, a series of dual-channel 600mA fixed voltage linear regulators and adjustable current limited power distribution USB switches.
Details
THine Electronics, Inc
THine has developed a new suite of LED Drivers for illumination signage and backlighting. The THL35xx series comes with internal gradient controller for full Color LEDs, while the THL65xx series is tailored for Power LEDs with a battery of powerful protection functions.
Details
Sequans
The SQN1310 delivers wireless broadband connectivity for fully mobile WiMAX® applications, targeting primarily handset and tablet products.
Details
THine Electronics, Inc.
THine launches new V-by-One®HS products especially designed for multifunction printers, cameras, and amusement markets. The new high-speed devices reduce LVDS cable lines, parts count, noise and EMI, thus cost.
Details
Dai-Ichi Seiko Co., Ltd.
Employing I-PEX' proprietary W-point structure, this connector is ideal in particular for mounting in digital TV sets providing a most reliable means of LVDS signal transmission.
Details
Backlogs
All brand, product and company names are the trademarks or registered trademarks of their respective companies. Product specifications provided on this site are guideline and do not constitute or substitute the products' data sheet. Information provided on this site may change without advance notice.
Silicon Technology Co., Ltd. has been accredited Internal Quality Management Standard ISO 9001 and Environmental Management Standard ISO 14001. Click to enlarge.

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Updates

Jan 7, 2013

Sanico
Silicon Technology now carries Sanico Electronics' MEMS and ECM microphones.

Oct 10, 2012

Sequans Sequans Introduces StreamliteLTE, a New Line of Chips for the Internet of Things.

Oct 10, 2012

LOCOSYS Silicon Technology now carries LOCOSYS' high sensitivity GPS modules and antennae.

May 8, 2012

Sequans Sequans Introduces LTE™ Active Interference Rejection Technology - Sequans AIR™

Apr 4, 2012

NextWindow NextWindow announces 5-touch optical desktop touch screen with 6 cameras.

Mar 6, 2012

THine
THine releases new V-by-One® HS products for office and industrial use.

Jan 24, 2012

Enverv
Silicon Technology now carries EnVerv's advanced SoC solutions for Smart Grid, Metering & Control Applications

Oct 26, 2011

GiantPlus
Silicon Technology now carries GiantPlus' line of STN & TFT LCD modules.

Oct 26, 2011

HannStar
Silicon Technology now carries HannStar's line of TFT-LCD modules.

Oct 20, 2011

Kepo Electronics
Silicon Technology now carries Kepo Electronics' line of piezo, audio and alarm components.

Sep 7, 2011

NEW RFaxis manufactures the world's first 5GHz WLAN RF front-end in pure CMOS.

Mar 22, 2011

NEW Sequans Announces New WiMAX Chip, the SQN1310, for Handsets and Tablets.

Mar 10, 2011

NEW Sequans Powers "HTC EVO WiMAX" Smartphone for KDDI as WiMAX smartphones enter Japan.
Backlogs


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